Electronics giant Intel has released a video detailing how a "pile of sand" is gradually "gaining intelligence", turning into a processor chip, made using a 10nm process technology.
To turn into it, a semi-finished plate needs to go through more than 1000 operations to form and accumulate an array of transistors.
The video briefly summarizes some of Intel's technologies behind the FinFET (Metal Oxide Semiconductor Field Effect Transistor). It also mentions COAG technology, which is rumored to have once caused Intel's 10nm chip efficiency issues.
In addition, we see the stage of attaching dozens of wires that combine the fragments of the chip into a single device. As you know, with a decrease in the size of transistors, resistance increases, and scaling of wires to transistors creates other problems, in particular, with the migration of electrons (the phenomenon of transfer of matter in a conductor due to the gradual drift of ions - ed. By Techcult). To solve this problem, Intel began to use cobalt instead of copper for connections.
According to the company's forecasts, it may in the near future lag behind its main competitors - and, first of all, from the Taiwanese TSMC. To prevent this from happening, Intel must by all means launch the production of new 7nm processors by the end of 2021.